Joint Symposium 2019
e-Manufacturing & Design Collaboration and ISSM

Online Registration Deadline: 2019/09/04
2019/09/04線上報名截止

 Keynote Speech "Challenges and opportunities for Taiwan High-technology industry" by Professor Chin-Tay Shih, Morris Chang Chair Professor, Institute of Technology Management, NTHU.

Invited Speech "How Artificial Intelligence is driving new compute architectures in an emerging memory centric world" by Steve Pawlowski,VP, Advanced Computing Solutions, Micron Technology.

Invited Speech “Benefits and Challenges of Deploying AI in Semiconductor Design and Manufacturing” by Mr. Rajesh Berigei, Technical Evangelist, MathWorks.

Invited Speaker: Dr. Ted Way, Sr. Program Manager from Microsoft Corp, AI and Advanced Architecture division.

Invited Speech “Cognitive Factory transformation with AI” by Mr. Ryuhichiroh Hattori, Associate Partner of IBM Global CoC(Center of Competence) Electronic.

Invited Speech "Redefine your AI infrastructure" by Ms. Frances Chien, Unstructured Data Solution Corporate Advisory Engineer, DELL  Technologies



Program is available now.


Registration Fee


Early bird
      by 2019.8.15
Regular
      After 2019.8.15
TSIA MemberIndividualNT$ 3,000NT$ 4,000
>= 10 participatsNT$ 2,700NT$ 3,600
Non-MemberIndividualNT$ 6,000NT$ 8,000
>= 10 participatsNT$ 5,400NT$ 7,200
IEEE Member IndividualNT$ 4,800NT$ 6,400


Payment

(1) By Check :
        Payee:Taiwan Semiconductor Industry Association
        Address:Rm.1246, Bld. 51, 195, Sec. 4, Chung Hsing Rd., Chutung, Hsinchu 310, Taiwan
        To: Ms. Arin Huang

(2) By Wire :
        Payable to : Taiwan Semiconductor Industry Association
        Bank Name : Land Bank - Hsinchu Branch.
        Bank Address : No. 1, Chung Yung Rd., Hsinchu 300, Taiwan, R.O.C.
        A/C No. : 016-001-03685-1
      Swift Code : LBOTTWTP016

(3) By ATM
        Bank Name : Land Bank (005)
        A/C No. : 016-001-03685-1
      Please fax the receipt with name to 03-5820056

(4) By Credit Card

download icon Authorization sheet.pdf