Joint Symposium 2019
e-Manufacturing & Design Collaboration and ISSM

Online Registration Deadline: 2019/09/04

 Keynote Speech "Challenges and opportunities for Taiwan High-technology industry" by Professor Chin-Tay Shih, Morris Chang Chair Professor, Institute of Technology Management, NTHU.

Invited Speech "How Artificial Intelligence is driving new compute architectures in an emerging memory centric world" by Steve Pawlowski,VP, Advanced Computing Solutions, Micron Technology.

Invited Speech “AI based Predictive Maintenance technology and workflows” by Mr. Rajesh Berigei, Technical Evangelist, MatLab.

Invited Speaker: Dr. Ted Way, Sr. Program Manager from Microsoft Corp, AI and Advanced Architecture division.

Invited Speech “Cognitive Factory transformation with AI” by Mr. Ryuhichiroh Hattori, Partner, IBM GBS Global CoC (Center of Competence) Electronics; Member of IBM Industry Academy.

Invited Speech "Redefine your AI infrastructure" by Ms. Frances Chien, Unstructured Data Solution Corporate Advisory Engineer, DELL  Technologies

Program is available now.

Registration Fee

Early bird
      by 2019.8.15
      After 2019.8.15
TSIA MemberIndividualNT$ 3,000NT$ 4,000
>= 10 participatsNT$ 2,700NT$ 3,600
Non-MemberIndividualNT$ 6,000NT$ 8,000
>= 10 participatsNT$ 5,400NT$ 7,200
IEEE Member IndividualNT$ 4,800NT$ 6,400


(1) By Check :
        Payee:Taiwan Semiconductor Industry Association
        Address:Rm.1246, Bld. 51, 195, Sec. 4, Chung Hsing Rd., Chutung, Hsinchu 310, Taiwan
        To: Ms. Arin Huang

(2) By Wire :
        Payable to : Taiwan Semiconductor Industry Association
        Bank Name : Land Bank - Hsinchu Branch.
        Bank Address : No. 1, Chung Yung Rd., Hsinchu 300, Taiwan, R.O.C.
        A/C No. : 016-001-03685-1
      Swift Code : LBOTTWTP016

(3) By ATM
        Bank Name : Land Bank (005)
        A/C No. : 016-001-03685-1
      Please fax the receipt with name to 03-5820056

(4) By Credit Card

download icon Authorization sheet.pdf